Manufacturer Xilinx
Series UltraScale+ FPGA
Model Number XCVU13P-2FHGB2104I
Product Type Field-Programmable Gate Array (FPGA)
Speed Grade -2
Package Type Flip Chip High Ball Grid Array (FC-HBGA)
Pin Count 2104 pins
Temperature Grade Industrial (-40°C to +100°C)
Technology 16nm FinFET
Core Features High-performance logic, advanced I/O interfaces, embedded memory blocks
Applications Data centers, high-performance computing, networking, AI acceleration, aerospace
RoHS Compliance Yes (Lead-free)
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