Product Name: XC7Z010 – 1CLG225I
Manufacturer: AMD
Product Line: Zynq® – 7000
Category: Integrated Circuit (IC), Embedded – System – On – Chip (SoC)
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Dual – core ARM® Cortex® – A9 MPCore™ with CoreSight™
Flash Size: –
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Main Features: Artix™ – 7 FPGA, 28K logic cells
Operating Temperature: – 40°C ~ 100°C (TJ)
Package/Case: 225 – LFBGA, CSPBGA
Supplier Device Package: 225 – CSPBGA (13×13)
I/O Number: 86
Documentation and Media:
Manufacturer: AMD
Product Line: Zynq® – 7000
Category: Integrated Circuit (IC), Embedded – System – On – Chip (SoC)
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Dual – core ARM® Cortex® – A9 MPCore™ with CoreSight™
Flash Size: –
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Main Features: Artix™ – 7 FPGA, 28K logic cells
Operating Temperature: – 40°C ~ 100°C (TJ)
Package/Case: 225 – LFBGA, CSPBGA
Supplier Device Package: 225 – CSPBGA (13×13)
I/O Number: 86
Documentation and Media:
- Datasheet: Zynq – 7000 SoC Specification, Zynq – 7000 All Programmable SoC Overview, Zynq – 7000 User Guide
- Product Training Module: Powering Series 7 Xilinx FPGAs with TI Power Management Solutions
- Environmental Information: Xilinx REACH211 Cert
- EDA Model: XC7Z010 – 1CLG225I model
Environmental and Export Classification: - RoHS Status: Compliant with ROHS3
- Moisture Sensitivity Level (MSL): 3 (168 hours)
- REACH Status: Not affected by REACH
- ECCN: 3A991A2
- HTSUS: 8542.39.0060
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