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Attribute
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Description (Based on Audio Component Speculation)
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Type
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Audio IC (e.g., Audio Decoder/Processor) (To be confirmed)
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Product Description
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High-performance audio integrated circuit for audio signal processing (To be confirmed)
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Select All
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–
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Category
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Integrated Circuits (IC), Audio ICs
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Manufacturer
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Qiyin Tailun
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Series
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– (To be confirmed)
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Packaging
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Tape & Reel (TR) / Cut Tape (CT) (To be confirmed)
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Part Status
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Active (To be confirmed)
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Audio Resolution
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[e.g., 24-bit / 32-bit] (To be confirmed)
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Maximum Sample Rate
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[e.g., 96kHz / 192kHz] (To be confirmed)
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Data Interface
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[e.g., I2S, SPI, USB-C] (To be confirmed)
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Supply Voltage Range
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[e.g., 3.0V ~ 5.5V] (To be confirmed)
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Key Features
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[e.g., Low noise, DAC integration, EQ function] (To be confirmed)
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Operating Temperature Range
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[e.g., -20°C ~ 70°C] (To be confirmed)
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Package / Case
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[e.g., 24-QFN, 32-TSSOP] (To be confirmed)
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Mounting Type
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Surface Mount (To be confirmed)
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Base Part Number
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CI1302
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Product Detail Page of CI1301/CI1302/CI1303 Intelligent Voice Chips
1. Chip Overview: Industrial-Grade Standard, Stable and Reliable
CI1301, CI1302, and CI1303 chips strictly comply with industrial-grade design standards, featuring excellent environmental adaptability and reliability to ensure the stable operation of various intelligent devices. The chips have an operating temperature range covering -40°C to +85°C, enabling them to handle harsh environments effortlessly, whether in extremely cold outdoor conditions or high-temperature industrial scenarios. They meet the MSL3 moisture sensitivity level, effectively preventing the impact of humid environments on chip performance. Passing the IEC 61000-4-2 4K contact discharge test standard, the internal ESD enhancement design significantly improves anti-static capabilities. Meanwhile, they comply with the FCC electromagnetic compatibility standard to reduce the impact of electromagnetic interference on devices. In addition, the chips are made of environmentally friendly materials, fully meeting the ROHS and REACH environmental standards, balancing performance with green environmental protection.
2. Core Technology: 3rd-Generation BNPU, Unlocking Powerful Voice Capabilities
The chips are equipped with the independently developed 3rd-Generation BNPU (Neural Network Processor) Technology by Chipintelli, which serves as the cornerstone of the chips’ powerful voice functions. This technology fully supports various neural network models such as DNN (Deep Neural Network), TDNN (Time-Delay Neural Network), RNN (Recurrent Neural Network), and CNN (Convolutional Neural Network). It also features efficient parallel vector operation capabilities, enabling easy implementation of core functions including speech recognition, voiceprint recognition, command word self-learning, voice detection, and deep learning noise reduction.
Furthermore, relying on advanced algorithms and hardware design, the chips possess strong echo cancellation and environmental noise suppression capabilities. Even in noisy environments, they can accurately capture voice commands, ensuring a clear voice interaction experience. In addition, the chip solution supports multiple global languages such as Chinese, English, and Japanese, which can be widely adapted to the needs of different countries and regions, providing convenience for cross-regional product development.
3. Wide Applications: Covering Multi-Domain Intelligent Scenarios
With outstanding performance and flexible adaptability, CI1301, CI1302, and CI1303 chips can be widely applied in multiple fields. They endow various products with intelligent voice interaction and control capabilities, helping to create a wide range of intelligent voice solution applications. The specific application fields are as follows:
- Smart Home Appliances: Such as smart refrigerators, smart washing machines, and smart air conditioners. Users can control the on/off of home appliances and adjust parameters through voice commands, enhancing usage convenience.
- Smart Toys: Adding voice interaction functions to toys, such as voice conversations, story-telling, and command responses, increasing the fun and interactivity of toys.
- Smart Lighting: Enabling voice control of lighting on/off, brightness adjustment, and color temperature switching, creating a comfortable and intelligent lighting environment.
- Smart Wearables: Applied in devices like smart bracelets and smart watches, supporting voice wake-up, voice dialing, and voice control for function activation, improving the practicality of wearable devices.
- Smart Industry: Realizing functions such as voice-controlled operations and fault voice announcements in industrial equipment, improving the efficiency and safety of industrial production.
- Smart Automotive: Can be used in in-vehicle voice control systems, supporting voice navigation, music playback control, and window adjustment, providing a safe and convenient interaction method for driving.
4. Comprehensive Chip Features: Combining High Performance and High Adaptability
(1) Neural Network Processor and CPU
- Neural Network Processor BNPU V3: Adopting 3rd-generation hardware BNPU technology, it supports neural networks such as DNN, TDNN, RNN, CNN, and parallel vector operations. It can realize functions like speech recognition, voiceprint recognition, command word self-learning, voice detection, and deep learning noise reduction, providing strong computing support for voice processing.
- CPU: Equipped with a 32-bit high-performance CPU, the maximum operating frequency supports 220MHz. It also integrates a 32-bit single-cycle multiplier and supports DSP extension acceleration, ensuring the chip efficiently processes various data and instructions to meet the computing needs of complex application scenarios.
(2) Memory Configuration
The chip has rich built-in memory resources, eliminating the need for additional external storage devices, simplifying circuit design, and reducing costs. The specific configuration is as follows:
- Built-in 640KB SRAM, providing sufficient space for temporary data storage and ensuring efficient data processing.
- Built-in 512bit eFuse, which can be used to store important information such as unique chip identifiers and encryption keys, enhancing chip security.
- Built-in 1-4MB Flash, meeting the needs of firmware storage, voice data storage, and adapting to application scenarios with different capacity requirements.
(3) Audio Interface: High Sound Quality and Multi-Function
The chip has a built-in high-performance, low-power Audio Codec module, which performs excellently in audio processing. The specific functions are as follows:
- Supports dual-channel ADC sampling and single-channel DAC playback, ensuring high-quality audio collection and output.
- Supports the Automatic Level Control (ALC) function, which automatically adjusts the amplitude of audio signals to avoid excessive or insufficient volume, improving the listening experience.
- Flexibly supports multiple sampling rates including 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz, which can be selected according to different audio application scenarios.
- Supports one IIS audio expansion channel, facilitating connection with external audio devices and expanding audio functions.
- Supports one PDM interface, which can be directly connected to one or two digital MEMS microphones, simplifying the microphone connection method and improving the flexibility of audio collection.
(4) Power Management Unit (PMU): Efficient Power Supply and Simplified Design
It has 3 built-in high-performance LDOs (Low-Dropout Regulators). No additional power chips are required; only a small number of resistors and capacitors need to be matched around the chip to achieve stable power supply. This greatly simplifies circuit design and reduces hardware costs. At the same time, the chip supports direct 5V power input, with a power supply range supporting a minimum input of 3.6V and a maximum input of 5.5V, adapting to different power supply scenarios and improving power supply flexibility.
(5) Clock Configuration: Flexible Selection to Meet Requirements
The chip has a built-in RC oscillator and also supports an external crystal oscillator. Developers can flexibly choose to use the built-in RC or external crystal as the chip clock source according to the accuracy, cost, and other requirements of different application solutions, meeting diverse design needs.
(6) SAR ADC: High Precision and High Reusability
Equipped with 1 channel of 12-bit SAR ADC input channel, the sampling frequency can reach 1MHz, featuring high-precision data collection capabilities and can be used to collect various analog signals. In addition, the ADC IO can be multiplexed with digital GPIO functions, improving pin utilization and optimizing the chip’s pin resource configuration.
(7) Peripherals and Timers: Rich Interfaces to Meet Multi-Scenario Control
The chip integrates rich peripheral interfaces and timer resources, providing sufficient support for device control and expansion:
- UART Interfaces: 3 UART interfaces, with a maximum support of 3M baud rate, facilitating data communication with various serial devices such as modules and sensors.
- IIC Interface: 1 IIC interface, which can be connected to external IIC devices for function expansion, such as memory chips, sensors, and display modules, expanding device functions.
- PWM Interfaces: 6 PWM interfaces, which can directly drive lighting control and motor applications without additional driver circuits, simplifying design and reducing costs.
- Timers: 4 groups of 32-bit timers built-in, which can be used for precise timing and timing control scenarios, meeting the device’s requirements for time accuracy.
- Watchdogs: 1 group of independent watchdog (IWDG) and 1 group of window watchdog (WWDG) built-in, effectively preventing program runaway and ensuring stable chip operation.
(8) GPIO: High Flexibility and Strong Compatibility
The chip supports 10 GPIO ports, which can be used as the main control IC to meet the control needs of multiple devices. Each GPIO port can be configured with interrupt function, and all GPIO ports support configurable pull-up and pull-down, adapting to the connection needs of different external circuits. Some GPIOs support direct communication with wide-voltage 5V level signals, no external level conversion is required (but an external resistor pulled up to 5V is needed), simplifying circuit design and improving compatibility.
5. Software Development Support: Convenient and Efficient, Accelerating R&D
To help developers quickly carry out product R&D work, CI1301, CI1302, and CI1303 chips provide comprehensive software development support. Developers can obtain a complete software development kit, rich application solution examples, and also create firmware online through the voice development platform, which greatly reduces development difficulty and shortens the R&D cycle. For more detailed information, please visit the official voice development platform:
6. Firmware Burning and Protection: Safe and Reliable, Safeguarding Rights and Interests
The chip supports the UART upgrade method, facilitating developers to update and maintain the firmware and improving product iteration efficiency. At the same time, it has a firmware protection function, which effectively prevents the firmware from being illegally read and tampered with, safeguarding the developers’ intellectual property rights and product security.
7. Packaging and Physical Parameters: Compact and Exquisite, Adapting to Compact Design
- Packaging Type: Adopting SSOP24 packaging, with a package size of 8.6mm in length, 6mm in width, and 1.75mm in height. The compact package size is convenient for layout in devices with limited space, adapting to various compact design needs.
- Operating Ambient Temperature: As mentioned earlier, the chip has an operating temperature range of -40℃ to 85℃, which can work stably in harsh temperature environments, expanding the product application scenarios.
Company Introduction
Shenzhen Merrillchip Electronics Co., Ltd. We specialize in providing one-stop integrated manufacturing services for customers in industries such as automotive electronics, medical electronics, and industrial automation.
We have multiple certifications, including ISO 14001, ISO 9001, and IATF 16949 system certifications, to ensure that product quality meets the highest standards. OEM SMT patch, dip plug-in, post welding, testing, assembly and packaging process. In addition, we also provide OEM, OEM, ODM, PCB PCBA as well as electronic components and other services to ensure that we provide you with original chip samples and high-quality electronic components procurement services!
FAQ
1. who are we?
We are based in Guangdong, China, start from 2013,sell to North America(30.00%),Eastern Europe(15.00%),Eastern Europe(15.00%),Western Europe(10.00%),Southeast Asia(10.00%),Western Europe(10.00%),Southeast Asia(10.00%),Oceania(5.00%),Southern Europe(5.00%),Northern Europe(5.00%),Eastern Asia(5.00%),South America(5.00%),Oceania(5.00%),Southern Europe(5.00%),Northern Europe(5.00%),Africa(4.00%),Mid East(4.00%),Africa(4.00%),Mid East(4.00%),Central America(1.00%),South Asia(1.00%),Central America(1.00%). There are total about 11-50 people in our office.
2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;
3.what can you buy from us?
PCBA, PCB, OEM PCBA, FPGA, Components Purchase Service
4. why should you buy from us not from other suppliers?
Merrillchip is an electronic component distribution company headquartered in Shenzhen, the largest electronics region in Asia. Main business: Electronic components, IC chip DIP external, post-solder test, assembly package, OEM, PCB PCBA EMS services
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