MYF – F63VA01 Compact Wireless Module
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Attribute
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Details
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Model
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MYF – F63VA01
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Chip
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WS63V100
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Processor
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RISC – V 32 – bit
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Storage
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RAM 606KB, ROM 300KB, Flash 4MB
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Communication Protocols
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2.4G Wi – Fi6, SLE1.0, BLE 5.3
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Peripheral Interfaces
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1 SPI, 1 QSPI, 2 I2C, 3 UART, 19 GPIO, 6 – channel ADC input, 8 – channel PWM
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Dimensions
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20.00mm * 14.00mm * 3.00mm (±0.1)
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Number of GPIOs
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19
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Antenna
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PCB onboard antenna
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Communication Distance
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Wi – Fi (260 meters), SLE (750 meters), BLE (270 meters)
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Number of XingShan Slaves
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Up to 15 supported
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Power Supply
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3.0~3.6 V
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Main Frequency
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Maximum 240MHz
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Operating Temperature
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-40 ~ 85 °C
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(Merrill Chip) Headquartered in shenzhen, the window city of China’s reform and opening up, Merrill Chip was founded in 2013. After years of forging ahead, Merrill has gradually developed from an agent of international semiconductor products into a high-tech enterprise integrating semiconductor circuit manufacturing, Chip research and development, business services and software development
(Merrill Chip)has always adhered to the revitalization and development of China’s microelectronics industry as its own responsibility, shoulder the enterprise mission of “innovative service society”, and constantly explore the market, and strive to forge ahead, cast a smart, capable, experienced, creative service team.
At the same time, huanyu with good performance and business reputation, and military products in charge of the department and many research and production units to establish a close relationship of cooperation.
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