Attribute Category (属性类别)
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English Attribute Value (英文属性值)
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Key Description (核心说明)
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Basic Identification (基础标识)
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Brand
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Chipintelli
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Official English brand name, ensuring consistent global brand recognition
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Model Number
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CI1312
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Unique product model, accurately matching core search terms like “CI1312 edge AI chip”
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Product Type
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Ultra-High Performance Edge AI Neural Network Voice Chip
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Upgraded to “ultra-high performance” positioning, highlighting “Edge AI” core label to distinguish from CI1306’s basic “high-performance” attribute
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Core Performance (核心性能)
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CPU Frequency
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260MHz
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8.3% higher than CI1306 (240MHz), providing enhanced computing power for multi-task parallel processing
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Flash Memory
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8MB
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Doubled capacity vs. CI1306 (4MB), supporting large-scale AI models and multi-round dialogue logic storage
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SRAM
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1MB
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66.7% expanded vs. CI1306 (640KB), ensuring high-speed data caching for low-latency response
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AI Processor
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BNPU V4 (Neural Network Processing Unit)
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Self-developed 4th-gen AI processing unit, 50% higher computing power than BNPU V3, optimized for edge NLP and multi-mic array processing
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Audio Integration
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Integrated High-Fidelity Audio Codec
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Eliminates external audio chips, reducing BOM cost by 30% and simplifying audio scheme design
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Core Functions (核心功能)
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Primary Functions
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Offline Speech Recognition + 10+ Multi-User Voiceprint Authentication + Advanced Edge AI NLP
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Industry-exclusive “triple intelligent upgrade”, supporting multi-round dialogue (e.g., “Turn on AC → Set to 24°C”) and multi-account identity verification
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Recognition Accuracy
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≥98% (Near-Field); ≥96% (15m Far-Field); ≥88% (90dB Strong Noise)
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Extended 15m far-field pickup (vs. CI1306’s 10m), maintaining high accuracy in extreme noise environments
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Noise Cancellation
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DNN Noise Reduction + AEC (Acoustic Echo Cancellation)
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Dual acoustic optimization, effectively filtering background noise and device echo for clear interaction
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Far-Field Pickup
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15m Max. Distance, 360° Omnidirectional, 6-Mic Array Support
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Supports 6-microphone array access, expanding coverage for large spaces like commercial lobbies and car cockpits
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Upgrade Support
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Dual-Mode OTA (Over-the-Air) Firmware Upgrade
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Supports both full-package and incremental upgrades, reducing upgrade traffic by 70% for efficient function iteration
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Command Word Capacity
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≥1000 Customizable Offline Command Words
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Doubled capacity vs. CI1306 (500+), adapting to complex scenario customization needs
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Technical Specifications (技术规格)
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Operating Temperature Range
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-40°C ~ +105°C
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20°C higher upper limit vs. CI1306 (85°C), suitable for harsh environments like automotive engine bays
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Interface Type
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UART, I²C, IIS, SPI, GPIO
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Added high-speed SPI interface, enabling seamless connection with high-speed peripherals like touch screens
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ESD Protection
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±8KV (Contact); ±15KV (Air)
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Upgraded protection level vs. CI1306 (±4KV contact), enhancing anti-interference in industrial assembly and use
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Supply Voltage
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3.3V ~ 5.5V
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Wide voltage input range, compatible with lithium battery and industrial power supply schemes
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Typical Power Consumption
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≤45mA (Working); ≤8μA (Standby)
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10% lower working power vs. CI1306, extending battery life for wearable and wireless devices
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Application Scenarios (应用场景)
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Smart Home (Central Controllers), Automotive (Intelligent Cockpits), Healthcare (Medical Terminals), Commercial Kiosks, Industrial Control (High-End Equipment)
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Newly added “healthcare” and “commercial” high-end scenarios, covering consumer, industrial and medical fields
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Compliance & Certification (合规认证)
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ROHS, REACH, FCC, CE, ISO 10605
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Added ISO 10605 ESD certification, meeting access requirements for medical and automotive high-standard markets
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Company Introduction
Shenzhen Merrillchip Electronics Co., Ltd. We specialize in providing one-stop integrated manufacturing services for customers in industries such as automotive electronics, medical electronics, and industrial automation.
We have multiple certifications, including ISO 14001, ISO 9001, and IATF 16949 system certifications, to ensure that product quality meets the highest standards. OEM SMT patch, dip plug-in, post welding, testing, assembly and packaging process. In addition, we also provide OEM, OEM, ODM, PCB PCBA as well as electronic components and other services to ensure that we provide you with original chip samples and high-quality electronic components procurement services!
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